• High-conductivity thermal paste made with carbon microparticles, ensuring efficient and rapid heat transfer in CPUs and GPUs. • Its consistency makes application easy and is safe, as it is non-conductive and non-corrosive, suitable for all types of heat sinks. • Provides excellent performance by preventing air gaps between the CPU and cooler, reducing the risk of short circuits and offering optimal protection for the equipment. • Notable for its high durability, as it does not require frequent reapplication and maintains its effectiveness for at least 5 years. • Widely used in CPUs, GPUs, laptops, and other electronic devices that require efficient thermal management.